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A study on the nanostructured W-Ti thin films deposited on Si

机译:沉积在Si上的纳米结构W-Ti薄膜的研究

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The W(90%)-Ti(10%) wt% alloy target is prepared and the W-Ti thin films are deposited by the dc Ar ~+ sputtering on silicon substrates. The morphology, composition, and microstructure of the alloy and thin films were observed. The structure was undertaken using X-ray diffraction (XRD). The morphology was determined by scanning electron microscopy with energy dispersive spectrometer (SEM-EDS) and high-resolution transmission electron microscopy (HRTEM). The surface composition and chemical bonding of elements on the Ti-W thin films after deposition and exposed to air were analyzed by X-ray photoelectron spectroscopy (XPS). The results show the structure evolves from amorphous film to dual phase (bcc W and bcc Ti) followed by uniform β-phase solid solution with increasing sputtering power. The sputtering power and bias voltage also have great effect on the resistivity of the W-Ti thin films.
机译:制备了重量百分比为W(90%)-Ti(10%)的合金靶,并通过dc Ar〜+溅射在硅基板上沉积了W-Ti薄膜。观察到合金和薄膜的形态,组成和微观结构。该结构使用X射线衍射(XRD)进行。形态通过能量分散光谱仪(SEM-EDS)和高分辨率透射电子显微镜(HRTEM)的扫描电子显微镜确定。通过X射线光电子能谱(XPS)分析了沉积后并暴露在空气中的Ti-W薄膜上元素的表面组成和化学键合。结果表明,该结构从非晶态薄膜演变为双相(bcc W和bcc Ti),随后随着溅射功率的增加,均匀的β相固溶体发生了变化。溅射功率和偏置电压也对W-Ti薄膜的电阻率有很大影响。

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