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首页> 外文期刊>Ceramic Engineering and Science Proceedings >DEVELOPMENT OF JOINING AND COATING TECHNIQUE FOR SiC AND SiC/SiC COMPOSITES UTILIZING NITE PROCESSING
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DEVELOPMENT OF JOINING AND COATING TECHNIQUE FOR SiC AND SiC/SiC COMPOSITES UTILIZING NITE PROCESSING

机译:SiC和SiC / SiC复合材料利用纳米加工的连接和涂层技术的发展

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摘要

For joining, the same SiC nano-powder and sintering additive with NITE processing to fabricate SiC were used. Silicon carbide or SiC/SiC plates were joined by hot-pressing at 1700-1900℃ for 1 hour under 20 MPa. The joined bars were evaluated by tensile test and asymmetric four point flexural test. For the coating, W is used considering the application. Starting materials were both fine powders and by lay-up two zones of powders (slurry) followed by hot pressing, two layers of W and SiC were produced with strong bonding. The joint thickness was controlled to approximately 10μm. The tensile strength for the joint of monolithic SiC was approximately 40 MPa with 40% porosity at the interface. The shear strength of the joint of monolithic SiC could not be obtained, since the crack at joint propagated into the substrate, but it was more than 90 MPa. After improving the technique, the dense joint was formed and then, the tensile strength increased to more than 250 MPa. For W coated SiC, SiC, W and their interface reaction layers can be controlled to make acceptable bonding by optimizing the materials used and process condition. Using the optimized condition, W coated SiC/SiC composites were developed, although the optimization of processing for the composites is still required.
机译:为了接合,使用相同的SiC纳米粉末和通过NITE工艺制造SiC的烧结添加剂。通过在20 MPa下在1700-1900℃下热压1小时来接合碳化硅或SiC / SiC板。通过拉伸试验和不对称四点挠曲试验评价连接的钢筋。对于涂层,考虑到应用使用W。起始材料均为细粉,先将两个区域的粉末(浆料)叠置,然后进行热压,然后生成两层具有牢固粘结力的W和SiC。接头厚度控制在大约10μm。整体式SiC接头的抗拉强度约为40 MPa,界面处的孔隙率为40%。由于接头处的裂纹扩展到基板中,因此无法获得整体式SiC接头的剪切强度,但超过90 MPa。改进工艺后,形成致密的接头,然后拉伸强度提高到250 MPa以上。对于W涂层的SiC,可以通过优化所用的材料和工艺条件来控制SiC,W及其界面反应层,以形成可接受的键合。尽管仍需要对复合材料的工艺进行优化,但在优化的条件下开发了W涂层SiC / SiC复合材料。

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