首页> 外文期刊>Ceramic Engineering and Science Proceedings >PROPERTIES OF NANOSTRUCTURED CARBON NITRIDE FILMS FOR SEMICONDUCTOR PROCESS APPLICATIONS
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PROPERTIES OF NANOSTRUCTURED CARBON NITRIDE FILMS FOR SEMICONDUCTOR PROCESS APPLICATIONS

机译:用于半导体工艺的纳米结构碳氮化物薄膜的性能

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摘要

The crystalline properties of nanostructured carbon nitride films are analyzed by XRD, SEM, XPS, EDS and FTIR for semiconductor process applications. The thickness and growth rate of CN{sub}X films with different growth conditions are reported and an empirical model is proposed for the thickness calculation to find growth conditions. The deposited carbon nitride has β-C{sub}3N{sub}4 and lonsdaleite peaks, uniform nanostructured surface which has grain size of about 50 nm. . The chemical formula of the deposited carbon nitride film is roughly expressed as C{sub}7N{sub}4 and C{sub}3N.
机译:通过XRD,SEM,XPS,EDS和FTIR分析了纳米结构氮化碳膜的晶体特性,以用于半导体工艺应用。报道了不同生长条件的CN {sub} X薄膜的厚度和生长速率,并提出了经验模型进行厚度计算,以求出生长条件。沉积的氮化碳具有β-C{sub} 3N {sub} 4和lonsdaleite峰,均一的纳米结构表面,其晶粒尺寸约为50 nm。 。沉积的氮化碳膜的化学式大致表示为C {sub} 7N {sub} 4和C {sub} 3N。

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