Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

Nobari Amir Hossein; Maalekian Mehran; Seelig Karl; Pekguleryuz Mihriban

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Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

机译：锑对镍和锗微合金化近共晶锡铜焊料润湿行为的影响

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摘要

Purpose - The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge.

机译：目的-本文的目的是研究Sb（0、0.2和2 wt。％）对由Ni和Ge微合金化的近共晶Sn-Cu无铅焊料的润湿性能的影响。

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来源
《Soldering & Surface Mount Technology》 |2016年第2期|共8页
作者
Nobari Amir Hossein; Maalekian Mehran; Seelig Karl; Pekguleryuz Mihriban;
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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Pb-free; Solder alloys; Wetting; Contact angle;

机译：无铅;焊料合金;润湿;接触角;

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专利

1. Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge [J] . Nobari Amir Hossein, Maalekian Mehran, Seelig Karl, Soldering & Surface Mount Technology . 2016,第2期

机译：锑对镍和锗微合金化近共晶锡铜焊料润湿行为的影响
2. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates [J] . C. LEINENBACH, F. VALENZA, D. GIURANNO, Journal of Electronic Materials . 2011,第7期

机译：共晶Au-Ge合金在Cu和Ni衬底上的润湿和钎焊行为
3. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates [J] . C. Leinenbach, F. Valenza, D. Giuranno, Journal of Electronic Materials . 2011,第7期

机译：共晶Au-Ge合金在Cu和Ni衬底上的润湿和钎焊行为
4. Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering [C] . Peng Sun, Cristina Andersson, Xicheng Wei, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis . 2006

机译：在回流焊接后，在Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中的金属间化合物形成在化学镜（P）浸没Au表面饰面
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Structure and properties of Sn-Cu lead-free solders in electronics packaging [O] . Meng Zhao, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子包装中的Sn-Cu无铅焊料的结构和性能
7. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates [O] . C. Leinenbach, F. Valenza, D. Giuranno, 2011

机译：Cu和Ni基材对共晶Au-Ge合金的润湿和焊接性能

Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

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