Synthesis of ultraviolet curable encapsulating adhesives and their package applications for organic optoelectronic devices

摘要

With conventional heating process, ultraviolet (UV) illumination, and microwave irradiation, we have successfully synthesized UV curable encapsulating adhesives with excellent gas barrier capabilities, good adhesive strength, moderate hardness, and high refractive indices. The experimental results manifest that the physical properties of lab-made encapsulating adhesives are highly dependent on their chemical structures and synthetic procedure. We also discover that the encapsulating adhesive prepared by microwave irradiation (i.e. encapsulating adhesive VI-MW) exhibits better adhesive strength and higher gas resistance than those prepared by conventional heating process and UV illumination. Furthermore, encapsulating adhesive VI-MW has also been applied for the package of organic light emitting diodes (OLEDs), flexible OLEDs, and organic solar cells. With encapsulating adhesive VI-MW, the entry of oxygen and moisture in the air into these organic optoelectronic devices has been blocked, therefore enhancing the lifetimes.