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Electroactive thermoset shape memory polymer nanocomposite filled with nanocarbon powders

机译:填充纳米碳粉的电活性热固性形状记忆聚合物纳米复合材料

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This paper concerns an electroactive thermoset styrene-based shape memory polymer (SMP) nanocomposite filled with nanosized (30 nm) carbon powders. With an increase of the incorporated nanocarbon powders of the SMP composite, its glass transition temperature (T_g) decreases and storage modulus increases. Due to the high micro-porosity and homogeneous distributions of nanocarbon powders in the SMP matrix, the SMP composite shows good electrical conductivity with a percolation of about 3.8%. This percolation threshold is slightly lower than that of many other carbon-based conductive polymer composites. Consequently, due to the relatively high electrical conductivity, a sample filled with 10 vol% nanocarbon powders shows a good electroactive shape recovery performance heating by a voltage of 30 V above a transition temperature of 56-69.
机译:本文涉及一种电活性热固性苯乙烯基形状记忆聚合物(SMP)纳米复合材料,其中填充了纳米级(30 nm)碳粉。随着SMP复合材料中纳米碳粉掺入量的增加,其玻璃化转变温度(T_g)降低,储能模量增加。由于SMP基质中的纳米碳粉具有较高的微孔率和均匀分布,因此SMP复合材料显示出良好的电导率,其渗透率为3.8%。该渗透阈值略低于许多其他基于碳的导电聚合物复合材料的渗透阈值。因此,由于相对较高的电导率,填充有10%(体积)纳米碳粉末的样品在高于56-69的转变温度下通过30 V的电压加热显示出良好的电活性形状恢复性能。

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