Low-Temperature Thermal CVD Process for Thin Film Encapsulation of Organic Light Emitting Devices

摘要

A Low-Temperature Thermal CVD process (LT-TCVD) is presented to fabricate a mechanically robust and thermally stable FAR2.2 polymer thin film for either a monolithic thin-film barrier layer or as part of a multi-layer barrier layer stack for encapsulation of OLED devices. FAR2.2(tm) polymer thin film is not only free of pinholes but also has a good step coverage. In particular, the LT-TCVD film deposition process is compatible with and benign to the underlying organic electroluminescence materials.