Heat-flux sensor to support transient thermal characterisation of IC packages

摘要

in this paper the idea and the analysis of a microelectronic heat-flux sensor, designed for fast transient measurements in package characterisation is presented. The sensor was fabricated in a prototype version, and the measured results prove the validity of the design concepts. The sensitivity, temperature dependence and resolution values are calculated and evaluated. The questions of calibration are discussed. Three application examples are presented. In the first two it is demonstrated, how the sensor may support compact model generation of packages by measuring the time dependence of the heat flux leaving the package on a certain surface, and by enabling the direct measurement of the thermal transfer admittance parameters of packages. In the third example the sensor is realised in array form, providing the possibility to obtain the coarse heat flux map of a package surface. (C) 2004 Elsevier B.V. All rights reserved.