Direct drawing method for microfabrication based on selective metal plating technology

摘要

This paper describes a direct drawing method for a microfabri cation based on a selective metal plating technology. The selective metal plating technology allows metal plating where a seed material is drawn. it becomes possible to combine various materials, so that the proposed method may cover a classical micromachining at the rather large scale. The direct drawing method can be applied to various surfaces where it is not suitable for a conventional micromachining based on a photolithography technology. A specific drawing system has been constructed in order to apply the proposed method to three-dimensional structures in this study. A fabrication of a multi-layer circuit will be reported as the first example of applications. Next, plating metal patterns on various three-dimensional structures will be demonstrated. Furthermore, plating metal patterns on a ball will be reported. This result promises a possibility that the direct selective metal plating technology can also be applied to the so-called ball semiconductor technology at the rather large scale. (C) 2003 Elsevier Science B.V. All rights reserved. [References: 12]