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A novel refractive silicon microlens array using bulk micromachining technology

机译:利用体微加工技术的新型折射硅微透镜阵列

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摘要

We have developed refractive Si microlens array. Boron diffusion and etching selectivity with respect to boron density in an ethylenediamine pyrocatechol (EDP) etchant are utilized. When the EDP etchant meets the heavily boron doped p++ layer (above 2.5 × 10{sup}19 atoms/cm{sup}3), the etching is nearly self-stopped. As a result, Si microlens is formed. Diffusion diameter and diffusion parameters such as temperature/time controlled the diameter, height, and focal length in ranges of 10-55, 2.5-7.5, and 45-79 μm, respectively, and the measured focal spot size is 3.8 μm, compares to a theoretical diffraction-limited spot size of 3.3 μm.
机译:我们已经开发了折射硅微透镜阵列。利用乙二胺邻苯二酚(EDP)蚀刻剂中硼的扩散和相对于硼密度的蚀刻选择性。当EDP蚀刻剂遇到重硼掺杂的p ++层(大于2.5×10 {sup} 19原子/ cm {sup} 3)时,蚀刻几乎会自动停止。结果,形成了Si微透镜。扩散直径和扩散参数(例如温度/时间)将直径,高度和焦距分别控制在10-55、2.5-7.5和45-79μm的范围内,而测得的焦点尺寸为3.8μm,与理论衍射极限光斑尺寸为3.3μm。

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