Improvement of Microstructure and Interface Structure of Eutectic Sn-0.7Cu Solder with Small Amount of Zn Addition

F. WANG; X. MA; Y. QIAN

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Improvement of Microstructure and Interface Structure of Eutectic Sn-0.7Cu Solder with Small Amount of Zn Addition

机译：少量添加锌改善Sn-0.7Cu共晶钎料的显微组织和界面结构

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摘要

With small amount of Zn addition, a refined microstructure of bulk Sn-0.7Cu solder alloy has been obtained. Meanwhile, retardation effect has been observed on the growth of IMC layer at the solder/Cu joint interface. The composition variation of the interface IMC layer with the amount of Zn addition is reported and thermodynamically analyzed.

机译：通过添加少量的Zn，就获得了块状Sn-0.7Cu焊料合金的精细组织。同时，已经观察到对焊料/铜接头界面处的IMC层的生长有延迟作用。报告并热力学分析了界面IMC层的组成随Zn添加量的变化。

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《Scripta materialia》 |2005年第6期|共4页
作者
F. WANG; X. MA; Y. QIAN;
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原文格式 PDF
正文语种 eng
中图分类金属学与热处理;
关键词
Intermetallic compounds; Microstructure; Thermodynamics; Lead-free solder;

机译：金属间化合物;微观结构;热力学;无铅焊料;

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专利

1. Improvement of Microstructure and Interface Structure of Eutectic Sn-0.7Cu Solder with Small Amount of Zn Addition [J] . F. WANG, X. MA, Y. QIAN Scripta materialia . 2005,第6期

机译：少量添加锌改善Sn-0.7Cu共晶钎料的显微组织和界面结构
2. Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy [J] . I. Shafiq, Y. C. Chan, N. B. Wong, Journal of materials science . 2012,第7期

机译：Sb纳米颗粒的添加量对Sn-9Zn二元共晶钎料合金的组织，硬度和拉伸性能的影响
3. Effect of nano Al_2O_3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads [J] . Tama Fouzder, Asit Kumar Gain, Y.C. Chan, Microelectronics reliability . 2010,第12期

机译：纳米Al_2O_3添加对Au / Ni金属化Cu垫上Sn-9Zn共晶焊料的组织，硬度和剪切强度的影响。
4. Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder balls [C] . Wu C.M.L., Law C.M.T. High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on . 2004

机译：共晶Sn-9Zn和Sn-0.7Cu无铅BGA焊球的组织演变和剪切强度
5. Effect of coarsened microstructure on electromigration behavior of eutectic lead-tin solder joints [D] . Lee, Yi-Chih 2010

机译：粗化微观结构对共晶铅锡焊点电迁移行为的影响
6. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys [O] . Wenchao Yang, Jidong Li, Yitai Li, 2019

机译：铝添加对非共晶Sn-20Bi焊料合金的组织和性能的影响
7. Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7Cu lead-free solder [O] . Amal Yassin 2019

机译：Zn和Sb添加对二元共晶Sn-0.7％Cu铅焊料的微结构，蠕变行为和热性能的影响

Improvement of Microstructure and Interface Structure of Eutectic Sn-0.7Cu Solder with Small Amount of Zn Addition

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