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首页> 外文期刊>Scripta materialia >Direct epitaxial growth of θ-Ni_2Si by reaction of a thin Ni(10 at.% Pt) film with Si(100) substrate
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Direct epitaxial growth of θ-Ni_2Si by reaction of a thin Ni(10 at.% Pt) film with Si(100) substrate

机译:Ni(10 at。%Pt)薄膜与Si(100)基板反应直接外延生长θ-Ni_2Si

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摘要

The reaction between an 11 nm Ni(10 at.% Pt) film on a Si substrate has been examined by in situ X-ray diffraction (XRD), atom probe tomography (APT) and transmission electron microscopy (TEM). In situ XRD experiments show the unusual formation of a phase without an XRD peak through consumption of the metal. According to APT, this phase has an Si concentration gradient in accordance with the θ-Ni_2Si metastable phase. TEM analysis confirms the direct formation of θ-Ni_2 Si in epitaxy on Si(100) with two variants of the epitaxial relationship.
机译:通过原位X射线衍射(XRD),原子探针层析成像(APT)和透射电子显微镜(TEM)检查了Si基板上11 nm Ni(10 at。%Pt)膜之间的反应。原位XRD实验表明,通过消耗金属可以形成不常见的无XRD峰的相。根据APT,该相的Si浓度梯度与θ-Ni_2Si亚稳相一致。 TEM分析证实,外延关系中的两个变体直接在Si(100)上直接形成θ-Ni_2Si。

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