Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

摘要

We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvmylpyrrohdone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvmylpyrrohdone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.