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Wear and corrosion behaviors of SiC-subP reinforced copper matrix composite formed by hot pressing

机译:热压成型SiC-subP增强铜基复合材料的磨损性能

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摘要

Wear and corrosion behaviors of SiCp reinforcedcopper matrix composite formed by not pressing were studied.The results show that the tensile strength, hardness and materialporosity increased with the increase of SiCp content. The wearrate of CuSiCp composites decreased with the increase of SiCpcontent, applied load and high sliding velocity (exceeds300rpm). In contrast the wear rate or Cu/Sic compositesincreased with low sliding velocity (100 rpm to 300). Adramatic wear rate of Cu/SiC composite is observed at the initialwear stage(0-400m). However, when sliding distance exceeds8000m/. The dwear behavior becomes more stable, in addition,the corrosion resistance of Cu/SiC composite in 5% NaClsolution increases with increasing pH value, but decreases withincreasing SiC content. Pits always initiate at the interfacialboundary between SiC and copper, which makes SiC particlespeeling and copper matrix pitting deeply.
机译:研究了非压制SiCp增强铜基复合材料的磨损性能。结果表明,随着SiCp含量的增加,其抗拉强度,硬度和材料孔隙率增加。 CuSiCp复合材料的磨损率随SiCp含量,施加载荷和高滑动速度(超过300rpm)的增加而降低。相反,在低滑动速度(100 rpm至300)下,磨损率或Cu / Sic复合材料增加。在初始磨损阶段(0-400m)观察到了Cu / SiC复合材料的剧烈磨损率。但是,当滑动距离超过8000m /时。磨损性能变得更稳定,此外,Cu / SiC复合材料在5%NaCl溶液中的耐蚀性随pH值的增加而增加,但随着SiC含量的增加而降低。坑总是在SiC和铜之间的界面处引发,这使SiC颗粒剥落和铜基体产生深坑。

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