Physics department, Linyi Normal University, Linyi 276005, P.R. China;
Key Laboratory of Liquid Structure and Heredity of Materials, Ministry of Education School of Materials Science and Engineering, Shandong University, Ji’nan 250061, P. R. China;
Korea Institute of Materials Science, 66 Sangnam-dong, Changwon 641-010, Korea;
SiCp/Cu composite; electroless copper plating; electrical conductivity;
机译:热压SiCp增强铜基复合材料的导热性能
机译:热压SiCp增强铜基复合材料的组织和力学性能
机译:SICP增强铜基质复合材料热压的热膨胀行为
机译:热压SICP增强铜基复合材料的电气特性
机译:钨铜复合材料的热等静压。
机译:热等静压法研究单晶α-Al2O3纤维增强铜石墨复合材料的组织和力学性能
机译:热变形期间双峰尺寸SICP增强MG矩阵复合的动态再结晶性能