Thermal Expansion Behaviour of SiCp Reinforced Copper Matrix Composites by Hot Pressing

摘要

Cu-coated SiC powder was fabricated by electroless copper plating process. SiCp reinforced copper matrix composites with the reinforcement content of 30-50 vol. percent were fabricated by hot pressing using the coated and uncoated powder. Microstructure and thermal expansion behaviour of the composites were studied. The results showed that, with the increase of temperature and SiCp particle size, the CTE of the composites increased. CTE of the composites can be reduced by the copper coating layer and annealing treatment. Important data for the application of SiCp/Cu composites as electronic packaging materials are provided.