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Al_2O_3 coating with a Ni-based buffer layer: Preparation, characterization and electrical insulating properties

机译:带有镍基缓冲层的Al_2O_3涂层:制备,表征和电绝缘性能

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摘要

Al_2O_3 coatings, with a Ni-based buffer layer (Ni or NiAl), were deposited on a Cu substrate by electron beam evaporation (EBE). The Al_2O_3 coatings were amorphous of good stoicniometry and their surface was undulated and continuous. The Ni-based buffer layer played a key role on improving the adhesion of the Al_2O_3 coatings to the substrate. The diffusion of Cu from the substrate into the Al_2O_3 coating at high temperature was suppressed by the buffer layer. Excellent resistivity (10~(15) OMEGA cm) and high breakdown voltage (110 kV/mm) have been obtained.
机译:通过电子束蒸发(EBE)将具有Ni基缓冲层(Ni或NiAl)的Al_2O_3涂层沉积在Cu基板上。 Al_2O_3涂层是具有良好化学计量的非晶态,并且其表面是起伏的且连续的。镍基缓冲层在改善Al_2O_3涂层对基材的附着力方面起着关键作用。缓冲层抑制了Cu在高温下从基板扩散到Al_2O_3涂层中。获得了优异的电阻率(10〜(15)OMEGA cm)和高击穿电压(110 kV / mm)。

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