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首页> 外文期刊>Optik: Zeitschrift fur Licht- und Elektronenoptik: = Journal for Light-and Electronoptic >High-speed CMOS readout integrated circuit for large-scale and high-resolution microbolometer array
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High-speed CMOS readout integrated circuit for large-scale and high-resolution microbolometer array

机译:用于大规模和高分辨率微测辐射热计阵列的高速CMOS读出集成电路

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摘要

A new CMOS readout integrated circuit (ROIC) for microbolometric focal plane array (FPA) is proposed in this paper. By applying multiple-module parallel working technique, the pixel readout speed of the CMOS ROIC can reach 10 MHz, which is very suitable for large-scale microbolometer array. The CMOS ROIC of each parallel working module consists of three major parts: direct injection (DI) input circuits, column-shared integrating circuits, and common noise-suppressing circuits. The readout structure of the ROIC is simple because of the DI input, shared and common circuits, and this makes the ROIC satisfy the requirements of small-pixel microbolometric FPA. Furthermore, the voltage signals from different working modules can be output according to a certain order through a high-speed output circuit. An experimental readout chip based on the proposed ROIC has been designed and fabricated to verify its readout function and performance. The measurement results of the experimental readout chip have successfully proved that the proposed CMOS ROIC can be applied to high-speed, low-noise, large-scale and high-resolution microbolometric FPA.
机译:本文提出了一种用于微辐射热焦平面阵列(FPA)的新型CMOS读出集成电路(ROIC)。通过应用多模块并行工作技术,CMOS ROIC的像素读出速度可以达到10 MHz,非常适合大规模微测辐射热计阵列。每个并行工作模块的CMOS ROIC包括三个主要部分:直接注入(DI)输入电路,列共享积分电路和公共噪声抑制电路。由于DI输入,共享电路和公用电路,ROIC的读出结构很简单,这使得ROIC满足了小像素微辐射热FPA的要求。此外,来自不同工作模块的电压信号可以通过高速输出电路按照一定顺序输出。设计并制造了一种基于拟议的ROIC的实验性读取芯片,以验证其读取功能和性能。实验读出芯片的测量结果已经成功证明了所提出的CMOS ROIC可以应用于高速,低噪声,大规模,高分辨率的微辐射热FPA。

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