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Photo-thermal staged-responsive shape memory polymers prepared by fused granular fabrication 4D printing

机译:熔融颗粒制造 4D 打印制备的光热分级响应形状记忆聚合物

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摘要

4D printing technology is advantageous for developing new shape memory effects and new functionalities. Herein, a new type of photo-thermal staged-responsive shape memory polymer (SMP) was prepared using fused granular fabrication (FGF) 4D printing technology. The integration of an azobenzene containing oligomer (Bisdi) with commercialized thermal-responsive SMP granules (PEC) resulted in composites (PEC-Bisdi) with good compatibility and higher thermal stability, suitable for FGF 4D printing. The granules made from the composite can also be used directly in the FGF printing technology. The specimens named PEC-Bisdi printed by FGF illustrated excellent photo-thermal staged responses with ultraviolet light (UV) responsive bending, thermal-responsive shape recovery, and good fixation at room temperature. The FGF-printed specimens also displayed good mechanical properties with up to 380 elongation at break and a 1.5 GPa glassy storage modulus. The influences of material factors and printing parameters were systematically investigated and the results showed an increase in the curvature of the spline as a function of Bisdi content and elongation, while a decrease was recorded as a function of the spline thickness. The optimal printing parameters for the highest curvature were determined to be an extrusion rate of 140, an extrusion temperature of 230 °C, a routing rate of 80, and a parallel infill pattern. Overall, the proposed PEC-Bisdi composites showing programmable and remotely controllable shape memory capabilities have the potential for use in advanced engineering and soft robotics.
机译:4D 打印技术有利于开发新的形状记忆效应和新功能。在此,使用熔融颗粒制造 (FGF) 4D 打印技术制备了一种新型光热分级响应形状记忆聚合物 (SMP)。将含偶氮苯的低聚物 (Bisdi) 与商业化的热响应 SMP 颗粒 (PEC) 相结合,产生了具有良好相容性和更高热稳定性的复合材料 (PEC-Bisdi),适用于 FGF 4D 打印。由复合材料制成的颗粒也可以直接用于 FGF 打印技术。FGF 打印的名为 PEC-Bisdi 的标本表现出优异的光热分级响应,具有紫外线 (UV) 响应性弯曲、热响应性形状恢复和室温下良好的固定。FGF 打印的样品还表现出良好的机械性能,断裂伸长率高达 380%,玻璃储能模量为 1.5 GPa。系统研究了材料因素和打印参数的影响,结果显示花键曲率增加与 Bisdi 含量和伸长率的函数关系,而减少则与花键厚度的函数关系。最高曲率的最佳打印参数被确定为挤出速率 140、挤出温度 230 °C、布线速率 80 和平行填充图案。总体而言,所提出的 PEC-Bisdi 复合材料显示出可编程和可远程控制的形状记忆功能,具有用于高级工程和软机器人的潜力。

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