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Solution processed nanomanufacturing of SERS substrates with random Ag nanoholes exhibiting uniformly high enhancement factors

机译:具有均匀高增强因子的无规Ag纳米孔的SERS基板的固溶处理纳米制造

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Achieving high Raman enhancement (SERS) that is relatively uniform over a large substrate area has been a major challenge in nanomanufacturing, as enhancement is localized around a plasmonic hotspot and hotspots are not usually spread uniformly over a substrate. Herein, we demonstrate a single-step, scalable method for the fabrication of Ag nanohole-based SERS substrates exhibiting similar to 10(8) enhancement factors. The SERS enhancement of these substrates could be further augmented by approximately 4 times through interference effects involving an underlying SiO2 spacer of controlled thickness on the Si substrate, in agreement with FDTD simulations. Electrical activation by applying a short DC pulse across the Ag film and Si substrate resulted in similar to 12% additional increase in the enhancement factor, while importantly the standard deviation of the signal across the 1 cm(2) substrate decreased from 9.5% to 3.1%. Both these effects could be attributed to electromigration of the metal producing protrusions on the nanoparticle surfaces thus populating with the hotspots for high performance SERS. These relatively uniform and reproducible SERS-chips with high enhancement factors can potentially be used as highly sensitive multi-functional platforms for point-of-care diagnostics.
机译:实现高拉曼增强(SERS)在较大的基板区域上相对均匀已成为纳米制造中的主要挑战,因为增强位于等离子体激元热点附近,而且热点通常不会均匀地分布在基板上。在这里,我们演示了一步法,可扩展的方法,用于制造具有类似于10(8)增强因子的Ag纳米孔基SERS基板。与FDTD模拟相一致,通过干扰效应,这些基底的SERS增强可以进一步增加约4倍,该干扰效应涉及Si基底上控制厚度的下层SiO2隔离层。通过在Ag膜和Si衬底之间施加短的DC脉冲来进行电激活会导致增强因子增加约12%,而重要的是,在1 cm(2)衬底上信号的标准偏差从9.5%降至3.1 %。这两种作用都可归因于纳米颗粒表面上产生金属的突起的电迁移,从而聚集了高性能SERS的热点。这些具有较高增强因子的相对均匀且可重现的SERS芯片可以潜在地用作即时诊断的高度敏感的多功能平台。

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