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机译:
Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095, USA, .;
机译:Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
机译:Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe
机译:Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Snndash;3.8Agndash;0.7Cu and Eutectic SnPb Solders
机译:通过SNPB焊料和Cu接口在SNPB焊料和Cu接口下通过磁通驱动的Cu / Sup 6 / Sn / Sup 5 /金属间化合物的形态学,生长和大小分布
机译:茎寄生植物相互作用中代谢产物的分析:Cu形versus与Cas叶-番薯的相互作用
机译:Fabrication of Ni-silicide/si heterostructured nanowire arrays by glancing angle deposition and solid state reaction
机译:exp 66的横截面Zn(N,p)exp 66 Cu,exp(113,in(N,N')/ sup113m / in和exp 115 in(N,N')/ sup 115m / in Reactions from Near Threshold to 10兆电子伏