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Influence of growth rate on charge transport in GaSb homojunctions prepared by metalorganic vapor phase epitaxy

机译:生长速率对金属有机气相外延制备GaSb同质结电荷输运的影响

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摘要

Dark current-voltage (I-V) characteristic measurement in the temperature range from -190℃ to 65℃ was carried out on GaSb p-n homojunctions prepared by low-pressure metalorganic vapor phase epitaxy. It was shown that the charge transport mechanism in these homojunctions is strongly affected by the growth rate of GaSb epitaxial layers. Samples prepared at higher growth rate (40 nm/min.) exhibit an anomalous low-temperature peak of tunneling current which can be explained by the presence of a narrow band of energies due to high concentration of native defects, probably Ga_(Sb) antisites. The same defect levels are responsible for the generation-recombination current which dominates in these samples at higher temperatures. On the other hand, quite different behavior was found in the case of slowly grown (20 nm/min) samples. At sufficiently low temperatures, a current maximum near 50 mV of forward voltage points out a band-to-band tunneling as a prevailing transport mechanism. With increasing temperature, however, this maximum disappears as at least one side of the junction becomes nondegenerate. Combination of the tunneling via energy states in the band gap and the thermal current governs the forward I-V characteristics at higher temperatures, whereas the direct tunneling remains dominant in the reverse direction.
机译:对低压金属有机气相外延制备的GaSb p-n同质结进行了-190°C至65°C温度范围内的暗电流-电压(I-V)特性测量.结果表明,这些同质结中的电荷传输机制受到GaSb外延层生长速率的强烈影响。以较高生长速率(40 nm/min.)制备的样品表现出异常的隧道电流低温峰值,这可以解释为由于高浓度的天然缺陷(可能是Ga_(Sb)反位点)而存在窄能量带。相同的缺陷水平是导致这些样品在较高温度下占主导地位的生成复合电流的原因。另一方面,在缓慢生长(20 nm/min)样品的情况下发现了完全不同的行为。在足够低的温度下,最大电流接近50 mV的正向电压表明,带间隧道是主要的传输机制。然而,随着温度的升高,这个最大值消失了,因为结的至少一侧变得非简并。在较高温度下,通过带隙中的能量状态隧穿和热电流的组合控制着正向I-V特性,而直接隧穿在相反的方向上仍然占主导地位。

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