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Electronic Raman scattering as an ultra-sensitive probe of strain effects in semiconductors

机译:电子拉曼散射作为半导体中应变效应的超灵敏探针

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Semiconductor strain engineering has become a critical feature of high-performance electronics because of the significant device performance enhancements that it enables. These improvements, which emerge from strain-induced modifications to the electronic band structure, necessitate new ultra-sensitive tools to probe the strain in semiconductors. Here, we demonstrate that minute amounts of strain in thin semiconductor epilayers can be measured using electronic Raman scattering. We applied this strain measurement technique to two different semiconductor alloy systems using coherently strained epitaxial thin films specifically designed to produce lattice-mismatch strains as small as 10(-4). Comparing our strain sensitivity and signal strength in AlxGa1-xAs with those obtained using the industry-standard technique of phonon Raman scattering, we found that there was a sensitivity improvement of 200-fold and a signal enhancement of 4 x 10(3), thus obviating key constraints in semiconductor strain metrology.
机译:半导体应变工程由于能够实现显着的设备性能增强,因此已成为高性能电子产品的关键特性。这些改进是由于应变引起的对电子能带结构的修改而产生的,因此需要新的超灵敏工具来探测半导体中的应变。在这里,我们证明了可以使用电子拉曼散射来测量薄半导体外延层中的微小应变。我们使用相干应变的外延薄膜将应变测量技术应用于两个不同的半导体合金系统,这些薄膜专门设计用于产生小至10(-4)的晶格失配应变。将我们在AlxGa1-xAs中的应变灵敏度和信号强度与使用工业标准声子拉曼散射技术获得的应变灵敏度和信号强度进行比较,我们发现灵敏度提高了200倍,信号增强了4 x 10(3),因此消除了半导体应变测量中的关键约束。

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