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Surface depletion thickness of p-doped silicon nanowires grown using metal-catalysed chemical vapour deposition

机译:使用金属催化化学气相沉积法生长的p掺杂硅纳米线的表面耗尽厚度

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An accurate evaluation of the radial dopant profile in a nanowire is crucial for designing future nanoscale devices synthesized using bottom-up techniques. We developed a very slow wet chemical etchant for gradually reducing the diameters of metal-catalysed, boron-doped silicon nanowires with varying diameters and lengths. Particular care has been taken to perform the experiment at room temperature to prevent dopant segregation, which is common in high temperature processes. By ensuring identical surface conditions subsequent to diameter reduction, the resistance of the nanowires was measured and, as anticipated, was found to increase with decreasing diameter. As the diameters were shrunk using wet-chemical etching, nanowires exhibited a non-linear increase of the resistance when the diameter was reduced to approx 50 nm. This is an indication of near-complete depletion in the nanowires caused by nanowire surface charges. The dopant concentration of the nanowires was found to be 2.1 x 10~(18) cm~(-3) and the corresponding surface charge density was around 2.6 x 10~(12) cm~(-2).
机译:纳米线中径向掺杂物轮廓的准确评估对于设计使用自底向上技术合成的未来纳米级器件至关重要。我们开发了一种非常缓慢的湿法化学蚀刻剂,用于逐渐减小具有不同直径和长度的金属催化的掺硼硅纳米线的直径。在室温下进行实验要特别小心,以防止掺杂剂偏析,这在高温工艺中很常见。通过确保减小直径后的相同表面条件,可以测量纳米线的电阻,并且可以预期,发现其随直径减小而增大。由于使用湿化学蚀刻缩小了直径,当直径减小到大约50 nm时,纳米线表现出电阻的非线性增加。这表明由纳米线表面电荷引起的纳米线几乎完全耗尽。发现纳米线的掺杂剂浓度为2.1 x 10〜(18)cm〜(-3),相应的表面电荷密度为2.6 x 10〜(12)cm〜(-2)。

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