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Graphene and thin-film semiconductor heterojunction transistors integrated on wafer scale for low-power electronics

机译:以晶圆级集成的石墨烯和薄膜半导体异质结晶体管,用于低功耗电子产品

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Graphene heterostructures in which graphene is combined with semiconductors or other layered 2D materials are of considerable interest, as a new class of electronic devices has been realized. Here we propose a technology platform based on graphene-thin-film-semiconductor-metal (GSM) junctions, which can be applied to large-scale and power-efficient electronics compatible with a variety of substrates. We demonstrate wafer-scale integration of vertical field-effect transistors (VFETs) based on graphene-In-Ga-Zn-O (IGZO)-metal asymmetric junctions on a transparent 150 × 150 mm~2 glass. In this system, a triangular energy barrier between the graphene and metal is designed by selecting a metal with a proper work function. We obtain a maximum current on/off ratio (I_(on)/I_(off)) up to 106 with an average of 3010 over 2000 devices under ambient conditions. For low-power logic applications, an inverter that combines complementary n-type (IGZO) and p-type (Ge) devices is demonstrated to operate at a bias of only 0.5 V.
机译:随着已经实现了新型的电子设备,其中石墨烯与半导体或其他分层的2D材料结合的石墨烯异质结构引起了人们的极大兴趣。在这里,我们提出了一个基于石墨烯-薄膜-半导体-金属(GSM)结的技术平台,该平台可应用于与各种基板兼容的大规模且节能的电子产品。我们演示了在透明150×150 mm〜2玻璃上基于石墨烯-In-Ga-Zn-O(IGZO)-金属不对称结的垂直场效应晶体管(VFET)的晶圆级集成。在该系统中,通过选择具有适当功函的金属来设计石墨烯与金属之间的三角能垒。我们获得的最大电流开/关比(I_(on)/ I_(off))高达106,在环境条件下,在2000个设备上平均达到3010。对于低功耗逻辑应用,结合了互补n型(IGZO)和p型(Ge)器件的逆变器被证明可在仅0.5 V的偏压下工作。

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