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Contactless measurement of surface dominated recombination in gold- and aluminum-catalyzed silicon vapor-liquid-solid wires

机译:金和铝催化的硅气液固导线中表面支配复合的非接触式测量

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摘要

Carrier lifetimes of Si microanowires grown by the vapor-liquid-solid method are measured using an extension of the classic contactless photoconductivity decay method. The samples measured consist of a thin aggregated film of oxide passivated wires on a fused silica carrier. Au catalyzed wires in the 392-730 nm diameter range are studied. Recombination in these wires is controlled by the surface or near surface effects, not bulk Au impurities. The lifetimes of Au- and Al-catalyzed wires of comparable diameter are measured. The Al wires are found to have slightly longer lifetimes than those grown with Au at a comparable diameter. Across all samples, the lifetimes measured range was from 0.2 to 1.0 ns. The surface controlled nature of the recombination measured implies larger diameter wires will offer better performance in devices that rely on minority carrier transport.
机译:通过经典的非接触式光电导衰减方法的扩展来测量通过气液固方法生长的硅微/纳米线的载流子寿命。所测量的样品由熔融石英载体上的氧化物钝化线的聚集薄膜组成。研究了在392-730 nm直径范围内的Au催化线。这些导线中的重组受表面或近表面效应控制,而不是受大量的Au杂质控制。测量了可比较直径的Au和Al催化金属丝的寿命。发现铝线的寿命比以类似直径的金生长的线稍长。在所有样品中,测量的寿命范围为0.2到1.0 ns。所测量的重组的表面控制性质表明,直径较大的导线将在依赖少数载流子传输的设备中提供更好的性能。

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