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首页> 外文期刊>Molecular crystals and liquid crystals >A Novel Synthetic Process of Polyimide/Poly (Methyl Silsesquioxane) Hybrid Materials with Nano/Micro Pore Structures
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A Novel Synthetic Process of Polyimide/Poly (Methyl Silsesquioxane) Hybrid Materials with Nano/Micro Pore Structures

机译:具有纳米/微孔结构的聚酰亚胺/聚(甲基倍半硅氧烷)杂化材料的合成新工艺

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摘要

A novel synthetic process for multi-porous polyimide (PI)/poly (methyl silsesquioxane) (PMSSQ) hybrid malerial has been studied via supercritical CO_2 technology. The end groups of PI precursors were modified by coupling agent to be hybridized with alkoxysilanes and became PMSSQ precursors. PI/PMSSQ hybrid precursor solution was spun on a silicon wafer substrate for film forma-lion. The PI precursor segment was imidized and micro-pores were developed by removal of by-product, CO_2 via. supercritical CO_2 media. The PMSSQ precursor segment was cured and nano-pores were generated by supercritical extraction. Average micro-pore size and nano-pore size were 10 mu m and 40nm respectively. The dielectric, constant of the multi-porous PI/PMSSQ hybrid film was calculated to 2.5.
机译:通过超临界CO_2技术研究了多孔聚酰亚胺(PI)/聚(甲基倍半硅氧烷)(PMSSQ)杂化马来醛的新型合成工艺。 PI前体的端基被偶联剂改性,与烷氧基硅烷杂交,成为PMSSQ前体。将PI / PMSSQ混合前驱体溶液旋涂在硅片基板上以形成膜。酰亚胺化PI前体片段,并通过去除副产物CO_2形成微孔。超临界CO_2介质。将PMSSQ前体段固化,并通过超临界萃取生成纳米孔。平均微孔尺寸为10μm,纳米孔尺寸为40nm。计算出多孔PI / PMSSQ混合膜的介电常数为2.5。

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