In this paper, the problem of the 3D castellated solder joint geometry of a leadless chip component in surface mount technology is investigated using the minimum potential energy theorem; the method of simulation of 3D solder joint geometry as a function of parameters of the design and manufacturing process through the Surface Evolver program is presented. The effects of solder volume, pad extension and stand-off height on solder joint geometry are analysed. In addition, a primary estimate of optimal solder volume and pad extension is obtained. Experimental verification shows that there is good agreement between experimental results and calculated ones. [References: 14]
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