...
首页> 外文期刊>Modern Physics Letters, B. Condensed Matter Physics, Statistical Physics, Applied Physics >Interaction between the 30° partial dislocation and hex-vacancy in silicon
【24h】

Interaction between the 30° partial dislocation and hex-vacancy in silicon

机译:30°局部位错与硅中的六方空位之间的相互作用

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The molecular dynamics (MD) method is used to investigate the interaction between the 30° partial dislocation and hex-vacancy (V _6) in Si. The interaction processes are described in detail and compared with the prior results of mono-vacancy (V _1) and di-vacancy (V _2). It is found that dislocations are pinned by V _6 when the shear stresses are smaller than a definite critical value τ _c. It illustrates that the encountered two segments beside vacant sites parallel each other or annihilate. Moreover, it is shown that the critical shear stress τ _c is mainly determined by both the migration barrier of kink and the volume of vacancy. Although V _6 cannot make dislocations move faster due to the present small models, it may lower the dislocation density in certain conditions due to the pinning effect.
机译:分子动力学(MD)方法用于研究Si中30°部分位错与六方位空位(V _6)之间的相互作用。详细描述了交互过程,并将其与先前的单空位(V _1)和双空位(V _2)的结果进行了比较。发现当剪切应力小于确定的临界值τ_c时,位错被V _6固定。它说明了在空位旁边遇到的两个段彼此平行或an灭。而且,表明临界剪切应力τ_c主要由扭结的迁移障碍和空位的体积决定。尽管由于目前的小型模型,V _6不能使位错移动得更快,但是由于钉扎效应,在某些条件下它可能降低位错密度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号