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ANALYSIS OF GROUND LAYOUT EFFECT IN CMOS CONCURRENT DUAL-BAND LNA

机译:CMOS同步双频LNA的接地布局效应分析

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Ground planes are often used on the integrated circuits. An improperly designed ground plane can be a major source of noise and attenuation to affect the circuit performances. Using a full-wave simulator HFSS, this article analyzes a ground plane effect in layout of a CMOS concurrent dual-band low-noise amplifier (LNA). The concurrent dual-band LNA that operates at 2.4 and 5.2 GHz is fabricated using 180-nm CMOS technology. Comparing with the circuit simulation result, the measured result shows a 7-dB gain reduction at 5.2 GHz. In an attempt to find the cause and solve the problem, a full-wave simulation that can analyze the layout effects is carried out. On the basis of the full-wave analysis, we determine that the ground plane potentially produces a parasitic inductive component which deteriorates the gain performance at the higher operating frequency band. A modified ground plane layout for reducing the parasitic inductance is proposed, and the LNA achieves the improved gain and noise performances similar to the circuit simulation.
机译:接地平面通常用于集成电路上。设计不当的接地层可能是噪声和衰减的主要来源,从而影响电路性能。本文使用全波模拟器HFSS分析了CMOS并发双频低噪声放大器(LNA)布局中的地平面效应。使用180 nm CMOS技术制造并发工作在2.4和5.2 GHz的双频段LNA。与电路仿真结果相比,测量结果显示在5.2 GHz时增益降低了7 dB。为了找到原因并解决问题,进行了可以分析布局效果的全波仿真。在全波分析的基础上,我们确定接地平面可能会产生一个寄生电感分量,该寄生电感分量会降低较高工作频段上的增益性能。提出了一种用于减小寄生电感的改进接地平面布局,并且LNA与电路仿真类似,可以实现改善的增益和噪声性能。

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