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A Terahertz CMOS V-Shaped Patch Antenna with Defected Ground Structure

机译:具有变形接地结构的太赫兹CMOS V形贴片天线

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摘要

In this paper, a V-shaped patch antenna with defected ground structure is proposed at terahertz to overcome the limited performance of a standard complementary metal-oxide semiconductor (CMOS) patch antenna consisting of several metal layers and very thin interdielectric layers. The proposed V-shaped patch with slots allows the increased radiation resistance and broadband performance. In addition, the patch resonating at different frequency from the V-shaped patch is stacked on the top to broaden the impedance-matching bandwidth. More importantly, the slots are formed in the ground plane, which is called the defected ground structure, to further increase the radiation resistance and thus improve the bandwidth and efficiency. It is verified from electromagnetic simulations that the leakage waves from the defected ground can enhance the antenna directivity and gain by coherently interfering with the topside radiation. The proposed on-chip antenna is fabricated using a standard 65 nm CMOS process. The on-wafer measurement shows very wide bandwidth in input reflection coefficient (<−10 dB), greater than 28.7% from 240 to >320 GHz. The measured peak gain was as high as 5.48 dBi at 295 GHz. To the best of the authors’ knowledge, these results belong to the best performance among the terahertz CMOS on-chip antennas without using additional components or processes such as dielectric resonators, lens, or substrate thinning.
机译:在本文中,提出了一种具有缺陷接地结构的V形贴片天线,其频率为太赫兹,以克服由几个金属层和非常薄的介电层组成的标准互补金属氧化物半导体(CMOS)贴片天线的性能限制。所提出的带有缝隙的V形贴片可以提高抗辐射能力和宽带性能。另外,以不同于V形贴片的频率谐振的贴片堆叠在顶部,以扩大阻抗匹配带宽。更重要的是,在接地平面上形成缝隙,这被称为缺陷接地结构,以进一步增加辐射电阻,从而提高带宽和效率。通过电磁仿真可以证明,缺陷地面的泄漏波可以通过相干干扰顶面辐射来增强天线方向性和增益。建议的片上天线是使用标准的65 nm CMOS工艺制造的。晶圆上测量显示出非常宽的输入反射系数带宽(<-10 dB),在240至> 320 GHz范围内大于28.7%。在295 GHz处测得的峰值增益高达5.48 dBi。就作者所知,这些结果属于太赫兹CMOS片上天线中最佳的性能,而无需使用诸如介电共振器,透镜或基板变薄之类的其他组件或工艺。

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