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A Terahertz CMOS V-Shaped Patch Antenna with Defected Ground Structure

机译:具有偏向地面结构的Terahertz CMOS V形贴片天线

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In this paper, a V-shaped patch antenna with defected ground structure is proposed at terahertz to overcome the limited performance of a standard complementary metal-oxide semiconductor (CMOS) patch antenna consisting of several metal layers and very thin interdielectric layers. The proposed V-shaped patch with slots allows the increased radiation resistance and broadband performance. In addition, the patch resonating at different frequency from the V-shaped patch is stacked on the top to broaden the impedance-matching bandwidth. More importantly, the slots are formed in the ground plane, which is called the defected ground structure, to further increase the radiation resistance and thus improve the bandwidth and efficiency. It is verified from electromagnetic simulations that the leakage waves from the defected ground can enhance the antenna directivity and gain by coherently interfering with the topside radiation. The proposed on-chip antenna is fabricated using a standard 65 nm CMOS process. The on-wafer measurement shows very wide bandwidth in input reflection coefficient (-10 dB), greater than 28.7% from 240 to 320 GHz. The measured peak gain was as high as 5.48 dBi at 295 GHz. To the best of the authors' knowledge, these results belong to the best performance among the terahertz CMOS on-chip antennas without using additional components or processes such as dielectric resonators, lens, or substrate thinning.
机译:在本文中,在太赫兹提出了一种具有偏转接地结构的V形贴片天线,以克服由几个金属层和非常薄的跨电池组成的标准互补金属氧化物半导体(CMOS)贴片天线的有限性能。具有槽的所提出的V形贴片允许增加的辐射电阻和宽带性能。另外,从V形贴片以不同频率谐振的贴剂在顶部堆叠,以扩大阻抗匹配带宽。更重要的是,在接地平面中形成槽,该接地平面被称为偏向的地面结构,以进一步增加辐射电阻,从而提高带宽和效率。它从电磁模拟中验证,即来自偏向的地面的泄漏波可以通过相干干扰顶部辐射来增强天线方向性和增益。使用标准的65nm CMOS工艺制造所提出的片上天线。晶圆测量在输入反射系数(& -10 db)中显示出非常宽的带宽,大于240到& 320 GHz的28.7%。测量的峰值增益在295GHz处高达5.48 dBI。据作者所知,这些结果属于Terahertz CMOS片上天线的最佳性能,而无需使用诸如介质谐振器,透镜或基板稀疏的附加部件或过程。

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