In a recent study on the measurement of SiO_(2) film thickness on a silicon substrate, the thicknesses measured by various methods showed large offset values, giving an apparent thickness when the real thickness was extrapolated to zero. Compensation of these offset values is a key solution for the establishment of traceability in the measurement of SiO_(2) film thickness. In this study, a mutual calibration method is suggested as a new method to certify the thickness of SiO_(2) films on Si by compensating for the offset values. In a linear plot of the thicknesses measured by x-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) of a series of SiO_(2) films with different thicknesses, the offset value of TEM and the thickness scale of XPS can be mutually calibrated. Using this method, the XPS photoelectron attenuation length can be well defined and XPS becomes traceable in the measurement of the thickness of SiO_(2) films.
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