Adhesive Resistance to Peeling Force of PTFE/PDMS Laminated Sheet Assisted by Homogeneous Low Voltage Electron Beam Irradiation at 77 K

摘要

The effects of homogeneous low voltage electron beam irradiation (HLEBI) under liquid nitrogen on the adhesive force of peeling (F-o(p)) at accumulative probability of peeling (P-p) of laminated PTFE/PDMS sheets of polytetrafluoroethylene (PTFE) and polydimethylsiloxane (PDMS) at 77 K were investigated without glue. F-o(p) values at each P-p of PTFE/PDMS laminated sheets irradiated of 0.04 to 0.43 MGy at both 77 and 298 K exceed the corresponding values of the untreated samples. Although 298 K-HLEBI with 0.04 MGy improves F-o(p) value at low P-p (0.06), 77 K-HLEBI didn't improve it. On the contrary, the 77 K-HLEBI with 0.22 MGy apparently enhanced the F-o(p) at low-P-p of 0.06. It is higher than that of 298 K-HLEBI with 0.22 MGy. Furthermore, the operation dose range at high F-o(p) value of more than 1.5 N m(-1) at low P-p (0.06) at 77 K, indicator of high industrial reliability of production process, was 0.33 MGy, which was more than 3.7 times broader than that at 298 K. Based on the 3-parameter Weibull equation, the lowest F-o(p) value at P-p of zero (F-s) could be estimated. The 0.22 MGy-HLEBI at 77 K apparently improves the F-s, which was higher than that 0.22 MGy-HLEBI at 298 K. Decreasing the irradiation temperature from 298 to 77 K controlled the rapid adhesion and rapid decay of adhesion at low-P-p, which were mainly caused by the low forming ability of dangling bonds induced by strong apparent bonding force, which is related to decreasing atoms vibration energy. Since the 0.22 MGy-HLEBI at 77 K controlled the recovery of dangling bonds and generated the chemical bonds, the strong adhesive force of PTFE/PDMS treated by 0.22 MGy-HLEBI at 77 K could be explained. Therefore, HLEBI under liquid nitrogen was useful tool for quick strong PTFE/PDMS lamination with sterilization for bio-adaptable application.