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首页> 外文期刊>Materials transactions >Relation of Shunting Current at Cracked Part to Critical Current and n-Value in Multifilamentary Bi2223 Composite Tape
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Relation of Shunting Current at Cracked Part to Critical Current and n-Value in Multifilamentary Bi2223 Composite Tape

机译:复丝Bi2223复合带裂纹部位的分流电流与临界电流和n值的关系

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摘要

Relation of transport current and n-value to collective crack-induced current shunting in BSCCO (Bi2223) multi-filamentary composite tape pulled in tension was studied experimentally and analytically. For analysis, the partial crack-current shunting model of Fang et al. was used by placing the collective crack as the partial one. It was shown that (a) collective crack-induced shunting current increases with increasing current (and voltage) and with increasing collective crack size, (b) the transport current normalized with respect to the transport current in non-cracked state is described with the modified ratio of non-cracked area to overall cross-sectional area of superconducting filaments at low voltage where shunting current is'low, while it deviates upward from the modified ratio at high voltage where the shunting current is enhanced, and (c) the enhanced shunting current acts to reduce n-value at high voltage. These features were similar to those of cracked coated conductor.
机译:通过实验和分析研究了BSCCO(Bi2223)复丝复合带中传输电流和n值与集体裂纹感应分流的关系。为了分析,Fang等人的部分裂纹电流分流模型。通过将整体裂纹作为局部裂纹来使用。结果表明:(a)集体裂纹引起的分流电流随电流(和电压)的增加以及整体裂纹尺寸的增加而增加,(b)相对于非裂纹状态下的传输电流归一化的传输电流用分流电流较低的低电压下非裂纹面积与超导细丝总横截面面积的比值变化,而分流电流增大的高电压下非裂纹面积相对于高电压下的比值向上偏离,并且(c)增大分流电流可降低高压下的n值。这些特征类似于破裂的涂覆导体的特征。

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