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首页> 外文期刊>Materials transactions >Effects of Homogeneous Low Voltage Electron Beam Irradiation on Adhesive Strength of Polycarbonate (PC) Sheet Covered with Nylon6 Film
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Effects of Homogeneous Low Voltage Electron Beam Irradiation on Adhesive Strength of Polycarbonate (PC) Sheet Covered with Nylon6 Film

机译:均相低压电子束辐照对尼龙6覆膜聚碳酸酯板粘合强度的影响

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摘要

The effects of homogeneous low voltage electron beam irradiation (HLEBI) on the adhesive strength of different polymers without glue but with sterilization were investigated. HLEBI at more than 0.043 MGy generated adhesive force and enhanced fracture strain at the interface in polycarbonate (PC) composites covered with nylon6 film. HLEBI at less than 0.130 MGy increased the elasticity (dcr/de) and fracture stress of the composites. Although it was far below that of commercial pure metal, the elasticity (2GPa) of composites irradiated from 0.130 to 0.216MGy was very close to that of nylon6. HLEBI from 0.216 to 0.432MGy increased the fracture strain of the composites, whereas it decreased elasticity (dcr/de). Based on the results, HLEBI from 0.130 to 0.432 MGy apparently maintained the high fracture strength of the composites. To investigate the influence of EB irradiation on adhesive strength, electron spin resonance (ESR) signals related to dangling bonds were observed. Since HLEBI generated dangling bonds in both PC and nylon6, the dangling bonds probably served as reactive and bonding sites for each polymer at the interface. Results indicated that HLEBI enhanced the adhesive strength of the composites, therefore, it was concluded that HLEBI was probably a useful tool for quickly joining the different polymers.
机译:研究了均相低压电子束辐照(HLEBI)对不同的不带胶但有杀菌作用的聚合物的粘合强度的影响。大于0.043 MGy的HLEBI在覆盖有尼龙6膜的聚碳酸酯(PC)复合材料中,在界面处产生粘合力并增强了断裂应变。小于0.130 MGy的HLEBI增加了复合材料的弹性(dcr / de)和断裂应力。尽管它远低于商业纯金属,但是从0.130到0.216MGy辐照的复合材料的弹性(2GPa)非常接近尼龙6的弹性。 HLEBI从0.216增加到0.432MGy,增加了复合材料的断裂应变,而降低了弹性(dcr / de)。根据结果​​,HLEB1从0.130至0.432 MGy显然保持了复合材料的高断裂强度。为了研究EB辐射对粘合强度的影响,观察到了与悬挂键有关的电子自旋共振(ESR)信号。由于HLEBI在PC和尼龙6中均产生了悬空键,因此悬空键可能充当界面处每种聚合物的反应位和键位。结果表明,HLEBI增强了复合材料的粘合强度,因此得出的结论是,HLEBI可能是用于快速连接不同聚合物的有用工具。

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