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Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper

机译:纯铜动态再结晶过程中晶粒粗化和细化的元胞自动机建模

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摘要

In this study, a cellular automata technique was developed to simulate a dynamic recrystallization process of pure copper. Moore’s neighboring rule was applied with partial fraction and time step control in the current approach to represent the grain growth kinetics more accurately. The cellular automata model developed in this study was applied to a simulation of the dynamic recrystallization of pure copper during hot deformation and compared with the experimental flow stresses and grain sizes determined from hot compression tests for validation. The predicted results were in reasonably good agreement with the experimental results. The grain coarsening and refinement phenomena were also investigated in detail. Finally, the effects of the process parameters on the microstructure and flow stress were investigated from various simulation results.
机译:在这项研究中,开发了一种细胞自动机技术来模拟纯铜的动态重结晶过程。摩尔的邻近法则在当前方法中应用了部分分数和时间步长控制,以更准确地表示晶粒生长动力学。在这项研究中开发的元胞自动机模型被用于模拟纯铜在热变形过程中的动态再结晶,并与通过热压试验确定的实验流动应力和晶粒尺寸进行比较以进行验证。预测结果与实验结果吻合良好。还对晶粒粗化和细化现象进行了详细研究。最后,从各种模拟结果中研究了工艺参数对组织和流动应力的影响。

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