Preparation of dry grinding diamond wheel with novel thermal conductivity based on resin-Cu-f composite matrix

摘要

Resin-based dry grinding wheels not only require the resin matrix to possess high thermostability, but also need to have good heat dissipation capability. In this paper, copper fibers with high thermal conductivity were introduced to fabricate resin-based composite diamond wheel. Experimental results show that the copper fibers form three-dimensional heat dissipation network which can transfer grinding heat from machining interface to wheel body rapidly and reduce the thermal cumulation effectively. The dry grinding effect of resin-Cu-f based diamond wheels was improved significantly by adding high thermally conductive copper fibers. When 15 wt% copper fibers were added to the resin-based matrix, the hardness value of the dry grinding diamond wheel reached 56 HRB, and the thermal conductivity of the dry grinding diamond wheel was improved to 15.14 W/mK, which is about 10.3 times of that without Cu-f. The service life of the dry grinding diamond wheel was increased by 50%.