Influence of the curing temperature in the mechanical and thermal properties of nanosilica filled epoxy resin coating

摘要

0.5-3 wt% nanosilica was added to an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) and cured at 25, 40 or 60 degrees C using isophoronediamine (IPDA) as hardener. Aggregates of nanosilica were properly dispersed into the DGEBA-IPDA resin and agglomerates formation was avoided. Addition of nanosilica increased the storage modulus E' and the area and height of the tan 6 curve of DGEBA-IPDA resin cured at 25 degrees C, but no significant differences were found by curing at higher temperature. Gel time measurements and the results obtained by applying the Kamal model to isotherm DSC curing of DGEBA-IPDA-nanosilica revealed that nanosilica catalysed the curing reaction between DGEBA and IPDA, in less extent by increasing the curing temperature.