A low temperature curing coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is (1) a polymer of polymerized monomers selected from the following group: styrene, methyl methacrylate, an alkyl methacrylate, an alkyl acrylate, each having 2-12 carbon atoms in the alkyl group and the polymer having pendant amino ester groups or hydroxy aminoester groups; (2) an epoxy resin and (3) a polyamine curing agent, The composition is used as a primer or topcoating for metal substrates and curings at temperatures of 0 DEG C. to ambient temperatures and at high relative humidity and provides a primer that has excellent adhesion to the substrate and provided a durable, corrosion resistant finish.
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