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首页> 外文期刊>Machining Science and Technology >MODELLING OF MATERIAL FLOW STRESS IN CHIP FORMATION PROCESS FROM ORTHOGONAL MILLING AND SPLIT HOPKINSON BAR TESTS
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MODELLING OF MATERIAL FLOW STRESS IN CHIP FORMATION PROCESS FROM ORTHOGONAL MILLING AND SPLIT HOPKINSON BAR TESTS

机译:正交铣削和霍普金森棒形试验在芯片形成过程中的材料流动应力建模

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摘要

Estimation of flow stress of the work material is central to both analytical and numerical modelling of the machining process. Results from split Hopkinson's pressure bar (SHPB) testing were used as a starting point for the estimation of flow stress. Subsequently material flow stress valid in the context of chip formation was computed from analytical model based on results from orthogonal milling tests. The milling operation involving cyclic variation of thickness of cut was carried out for a range of cutting speeds, generating information about flow stress over a wide range of strain, strain rate, and temperatures. Two work materials differing in phase content, namely pure ferritic (REMKO) and pure austenitic (AISI 316L) were the reference materials evaluated in this study.
机译:估算工作材料的流动应力对于加工过程的分析和数值建模都是至关重要的。分开的霍普金森压力棒(SHPB)测试得出的结果用作估计流应力的起点。随后,基于正交铣削测试的结果,从分析模型中计算出切屑形成时有效的材料流动应力。在一定范围的切削速度下进行涉及切削厚度周期性变化的铣削操作,从而生成有关在很大的应变,应变速率和温度范围内的流动应力的信息。相含量不同的两种工作材料,即纯铁素体(REMKO)和纯奥氏体(AISI 316L)是本研究中评估的参考材料。

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