TDEM simulation and analysis of thermal conduction through packed granular beds

摘要

The work deals with evaluation and simulation of the thermal discrete element method (TDEM) for particle-particle collision and thermal conduction in a packed bed. The effects of different granular properties, such as particle size, stiffness factor or compression degree, thermal diffusivity, void fraction or concentrations, and packing states, on the thermal conduction and insulation characteristics of granular assembly are discussed. The thermal conductivity and diffusion still play dominant roles in the overall thermal conduction and insulation of the granular bed. However, it is also indicated that increasing compression degree, reducing particle size and void concentration will increase the thermal conduction throughout the granular materials, and vice versa.