Resin composition,pre-preg and laminate

摘要

Kousuke Hirota,Koutarou Asahina,Kenji Shima,Hitoshi Sakuraba,and Takashi liyama filed patent application So 20050095434.The invention is to provide a Iteai-nate which is halogen-free,has sufficient flame retardancy even when ar thickness is not more fliaai'W,? mm,and has sufficient humidity resistance deg &USUS hygroscopic solder heSct resistance.