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Electrical and Physical Characteristics of Vanadium-Doped Bi_4Ti_30_(12) Ferroelectric Thin Films after Rapid Thermal Annealing

机译:快速热退火后掺钒的Bi_4Ti_30_(12)铁电薄膜的电学和物理特性

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摘要

The V_2O_s-doped Bi_4Ti_30_(12) of Bi_(3.9)Ti_2.9V_(0.08)O_(12) (BTV) ceramic was used as the target, and the BTV thin films were deposited on the F_t/Ti/SiO_2/silicon substrate by radio frequency (RF) magnetron sputtering. The physical characteristics of BTV thin films were prepared under different conditions to find the optimal deposited parameters. The electrical characteristics of BTV thin films under the optimal sputtering and annealing parameters were prepared by using metal-ferroelectric-metal structure. Additionally, the remnant polarization of deposited BTV thin films would be improved by rapid thermal annealing process from our study, and 2Pr was about 40μC/cm2. Finally, the nonvolatile and non-destructive characteristics of one transistor-capacitor (1TC) structure FRAM device, using the annealed BTV films as the gate oxide, were be fabricated and discussed.
机译:将Bi_(3.9)Ti_2.9V_(0.08)O_(12)(BTV)陶瓷中的V_2O_s掺杂的Bi_4Ti_30_(12)用作目标,并将BTV薄膜沉积在F_t / Ti / SiO_2 /硅衬底上通过射频(RF)磁控溅射。在不同条件下制备BTV薄膜的物理特性,以找到最佳的沉积参数。利用金属-铁电-金属结构制备了BTV薄膜在最佳溅射和退火参数下的电学特性。此外,通过我们的研究,通过快速热退火工艺可以改善沉积的BTV薄膜的残留极化,并且2Pr约为40μC/ cm2。最后,制造并讨论了一种以退火BTV薄膜作为栅氧化物的晶体管-电容器(1TC)结构FRAM器件的非易失性和非破坏性特性。

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