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Electrical Properties of Thin Film Type MLCC with Nickel Electrodes

机译:带镍电极的薄膜型MLCC的电性能

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摘要

The stability and electrical properties of Ni/BaTiO_3(BT)/Ni capacitors were investigated for the preparation of MLCCs by the deposition method. The Ni and BT films were deposited by r.f magnetron sputtering. The electrical resistivities of Ni films before and after annealing were 2.3 and 5.2 x 10~(-4) Ω-cm, respectively. The Ni electrode was completely oxidized at 650℃ in an O_2 atmosphere, but very stable in an Ar+H_2 atmosphere and in a vacuum. The interdiffusion depth between the nickel and BT layer at 650~800℃ was 90~100 nm. The capacitor annealed at 650℃ showed a dielectric constant of 258 and a dissipation factor of 3.1% at 1 kHz. The leakage current of Ni/BT/Ni capacitors increased with the increase of the annealing temperature. The leakage current density of the capacitors annealed at 650 and 700℃was about 4.5 x 10~(-6) and 7 x 10~(-4) A/cm~2 at 100 kV/cm, respectively. The Ni/BT/Ni capacitor prepared by the deposition method offers an attractive alternative for application in MLCCs with high volumetric efficiency.
机译:研究了Ni / BaTiO_3(BT)/ Ni电容器通过沉积法制备MLCC的稳定性和电学性能。通过射频磁控溅射沉积Ni和BT膜。退火前后镍膜的电阻率分别为2.3和5.2 x 10〜(-4)Ω-cm。 Ni电极在O_2气氛中在650℃时被完全氧化,但在Ar + H_2气氛中和真空中非常稳定。镍与BT层在650〜800℃的相互扩散深度为90〜100 nm。在650℃退火的电容器在1 kHz时的介电常数为258,耗散率为3.1%。 Ni / BT / Ni电容器的漏电流随着退火温度的升高而增加。在650和700℃退火的电容器在100 kV / cm时的泄漏电流密度分别为4.5 x 10〜(-6)和7 x 10〜(-4)A / cm〜2。通过沉积方法制备的Ni / BT / Ni电容器为高容量效率的MLCC应用提供了有吸引力的选择。

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