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首页> 外文期刊>Bulletin of the Korean Chemical Society >Annealing Temperature Dependence on the Physicochemical Properties of Copper Oxide Thin Films
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Annealing Temperature Dependence on the Physicochemical Properties of Copper Oxide Thin Films

机译:退火温度对氧化铜薄膜理化性质的影响

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We report the results of the characterization of Cu oxide thin films deposited by radio frequency (r.f.) magnetron sputtering at different annealing temperatures. The deposited Cu oxide thin films were investigated by scanning electron microscopy, spectroscopic ellipsometry, X-ray diffraction, atomic force microscopy, X-ray photoelectron spectroscopy, and contact angle measurements. The thickness of the films was about 180 nm and the monoclinic CuO phase was detected. The CuO2 and Cu(OH)2 phases were grown as amorphous phase and the ratio of the three phases were independent on the annealing temperature. The surface of Cu oxide films changed from hydrophilic to hydrophobic as the annealing temperature increased. This phenomenon is due to the increase of the surface roughness. The direct optical band gap was also obtained and laid in the range between 2.36 and 3.06 eV.
机译:我们报告了在不同退火温度下通过射频(r.f.)磁控溅射沉积的Cu氧化物薄膜的表征结果。通过扫描电子显微镜,椭圆偏振光谱,X射线衍射,原子力显微镜,X射线光电子能谱和接触角测量研究沉积的Cu氧化物薄膜。膜的厚度为约180nm,并且检测到单斜晶CuO相。 CuO 2和Cu(OH)2相作为非晶相生长,并且三相的比例与退火温度无关。随着退火温度的升高,氧化铜膜的表面从亲水性变为疏水性。这种现象是由于表面粗糙度的增加。还获得了直接光学带隙并将其置于2.36和3.06 eV之间的范围内。

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