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Electrical characterization of low temperature deposited oxide films on ZnO-Si substrate

机译:ZnO / n-Si衬底上低温沉积氧化膜的电学特性

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摘要

Thin films of silicon dioxide are deposited on ZnO-Si substrate at a low temperature using tetraethylorthosilicate (TEOS). The ZnO-Si films have been characterized by atomic force microscopy (AFM) and scanning electron microscopy (SEM). The border trap density (Q_(bt)) and fixed oxide charge density (Q_f/q) of the SiO_2/ZnO-Si films are found to be 3.9 X 10~(10) cm~(-2) and 1.048 X 10~(11) cm~(-2), respectively. The trapping characteristics and stress induced leakage current (SILC) have also been studied under Fowler-Nordheim (F-N) constant current stressing.
机译:使用原硅酸四乙酯(TEOS)在低温下将二氧化硅薄膜沉积在ZnO / n-Si基板上。 ZnO / n-Si薄膜已通过原子力显微镜(AFM)和扫描电子显微镜(SEM)进行了表征。 SiO_2 / ZnO / n-Si薄膜的边界陷阱密度(Q_(bt))和固定氧化物电荷密度(Q_f / q)为3.9 X 10〜(10)cm〜(-2)和1.048 X 10〜(11)cm〜(-2)在Fowler-Nordheim(F-N)恒定电流应力下,还研究了俘获特性和应力感应漏电流(SILC)。

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