Advances in computing technology have led to electronic devices that can achieve extraordinary processing feats in the smallest and slimmest of devices. While most consumers have grown accustomed to having such power in the palms of their hands, they have also unfortunately grown accustomed to the unpleasant heat produced from such compact and intensive electronic devices. In addition to increased touch and surface temperatures, elevated internal hardware temperature can lead to device performance degradation from heat-related stress or firmware related decreases in CPU processing speed. To maintain the sleek designs of current devices, active cooling such as fans or liquid circulation cannot be implemented due to space restrictions. This device miniaturization inherently drives the required heat dissipation into even smaller volumes. This leaves a ready, and unfilled, market for passive thermal control heat-sinks and like products to deal with thermal relief in space-limited electronic devices.
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