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首页> 外文期刊>Electrochimica Acta >Correlation of morphology and barrier properties of thin microwave plasma polymer films on metal substrate
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Correlation of morphology and barrier properties of thin microwave plasma polymer films on metal substrate

机译:金属基底上微波等离子体聚合物薄膜的形貌与阻挡性能的相关性

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The barrier properties of thin model organosilicon plasma polymers layers on iron are characterised by means of electrochemical impedance spectroscopy (EIS). Tailored thin plasma polymers of controlled morphology and chemical composition were deposited from a microwave discharge. By the analysis of the obtained impedance diagrams, the evolution of the water uptake φ, coating resistance and polymer capacitance with immersion time were monitored and the diffusion coefficients of the water through the films were calculated. The impedance data correlated well with the chemical structure and morphology of the plasma polymer films with a thickness of less than 100 nm. The composition of the films were determined by means of infrared reflection absorption spectroscopy (IRRAS), X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectrometry (ToF-SIMS). The morphology of the plasma polymer surface and the interface between the plasma polymer and the metal were characterised using atomic force microscopy (AFM). It could be shown that, at higher pressure, the film roughness increases which is probably due to the adsorption of plasma polymer nanoparticles formed in the plasma bulk and the faster film growth. This leads to voids with a size of a few tens of nanometers at the polymer/metal interface. The film roughness increases from the interface to the outer surface of the film. By lowering the pressure and thereby slowing the deposition rate, the plasma polymers perfectly imitate the substrate topography and lead to an excellent blocking of the metal surface. Moreover, the ratio of siloxane bonds to methyl-silyl groups increases which implies that the crosslink density is higher at lower deposition rate. The EIS data consistently showed higher coating resistance as well as lower interfacial capacitance values and a better stability over time for the film deposited at slower pressure. The diffusion coefficient of water in thin and ultra-thin plasma polymer films could be quantified for the smooth films. The measurements show that the quantitative evaluation of the electrochemical impedance data requires a detailed understanding of the film morphology and chemical composition. In addition, the measured diffusion coefficient of about 1.5×10{sup}(-14) cm{sup}2 s{sup}(-1) shows that plasma polymers can act as corrosion resistant barrier layers at polymer/metal interfaces.
机译:铁上的薄模型有机硅等离子体聚合物层的阻隔性能通过电化学阻抗谱(EIS)进行表征。通过微波放电沉积具有受控形态和化学组成的量身定制的薄等离子聚合物。通过对获得的阻抗图的分析,监测了吸水率φ,涂层电阻和聚合物电容随浸泡时间的变化,并计算了水在薄膜中的扩散系数。阻抗数据与厚度小于100 nm的等离子体聚合物薄膜的化学结构和形态密切相关。膜的组成通过红外反射吸收光谱法(IRRAS),X射线光电子能谱法(XPS)和飞行时间二次离子质谱法(ToF-SIMS)来确定。使用原子力显微镜(AFM)对等离子聚合物表面的形态以及等离子聚合物与金属之间的界面进行了表征。可以表明,在较高压力下,膜粗糙度增加,这可能是由于在等离子体块中形成的等离子体聚合物纳米颗粒的吸附和较快的膜生长所致。这导致在聚合物/金属界面处具有几十纳米大小的空隙。膜的粗糙度从膜的界面到外表面增加。通过降低压力,从而减慢沉积速度,等离子体聚合物完美地模仿了基材的形貌,并导致了金属表面的出色粘合。此外,硅氧烷键与甲基-甲硅烷基的比例增加,这意味着在较低的沉积速率下交联密度较高。 EIS数据始终显示较高的涂层电阻以及较低的界面电容值,并且在较慢的压力下沉积的薄膜随时间推移具有更好的稳定性。可以量化光滑薄膜中超薄等离子聚合物薄膜中水的扩散系数。测量结果表明,对电化学阻抗数据的定量评估需要对薄膜的形态和化学成分有详细的了解。另外,测得的约1.5×10 {sup}(-14)cm {sup} 2 s {sup}(-1)的扩散系数表明,等离子体聚合物可以在聚合物/金属界面上充当耐腐蚀阻挡层。

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