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Rapid intergranular corrosion of copper in sulfide-polluted salt water

机译:硫化物污染盐水中铜的快速晶间腐蚀

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Sulfide-induced intergranular corrosion (IGC) of copper was documented in salt water under free corrosion or controlled potential. The process was promoted by the oxidizing potential and the sulfide ions. A transition potential, E-t, of about -0.15 V (Ag/AgCl) was identified in the polarization curves in the presence of sulfide ions. Above E-t, sulfide ions accelerate IGC while having a modest effect on the rate of copper dissolution. Below E-t, they promote copper dissolution, while IGC occurs much more slowly. Various sulfur species were detected in the corrosion product using X-ray photoelectron spectroscopy.
机译:硫化物诱导的铜的晶间腐蚀(IGC)在自由腐蚀或可控电位下在盐水中记录。氧化电位和硫化物离子促进了该过程。在存在硫化物离子的极化曲线中鉴定出约-0.15 V(Ag / AgCl)的跃迁电势E-t。高于E-t时,硫化物离子会加速IGC,同时对铜的溶解速率产生适度的影响。低于E-t,它们促进铜溶解,而IGC发生的速度要慢得多。使用X射线光电子能谱仪检测了腐蚀产物中的各种硫。

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